B2B High Density SMT Connectors .050/(1.27mm) Pitch
Für das Produkt B2B High Density SMT Connectors .050/(1.27mm) Pitch besuchen Sie bitte unsere neue Webseite unter https://www.infratron.eu/sockel
Features:
- Robust, shrouded design with screw-machined terminals and multi-finger contacts can withstand the rigorous demands of blind mating and mating/unmating cycles
- At 3 amps per pin, more contacts can be assigned to data/signal transfer (fewer pins needed to handle power and ground)
- High density - over 400 contactsmper square inch
- Industry standard footprints in four mated heights
- Precision molded with integral polarization keying features