TG-A9000 Ultra Soft Thermal Pad
Für das Produkt TG-A9000 Ultra Soft Thermal Pad besuchen Sie bitte unsere neue Webseite unter https://www.infratron.eu/gap-filler
Best for high power applications
• High thermal conductivity
• Low thermal resistance
• High compressibility and compliancy
• Good electrical insulation
Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile
Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED,Mother Board,Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.