TG-A6200LC High Performance Thermal Pad
Für das Produkt TG-A6200LC High Performance Thermal Pad besuchen Sie bitte unsere neue Webseite unter https://www.infratron.eu/gap-filler
• Great thermal conductivity Best for low and medium power applications
• Difficult to be deformed
• Easy to assemble
• One side low tack
Application:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.