H48-2K Thermal Conductive Pad
- Non-reinforcement carrier
- Low contact thermal impedance
- Non-Oil Blead
- High dielectric breakdown voltage
Applications:
- Electronic components: IC / CPU / MOS
- LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc....
- DDR II Module / DVD Applications / Hand-Set applications etc...