TG4040 Ultra Soft Thermal Conductive Pad
Für das Produkt TG4040 Ultra Soft Thermal Conductive Pad besuchen Sie bitte unsere neue Webseite unter https://www.infratron.eu/gap-filler
- Good thermal conductivity, Low thermal resistance
- Electrical Insulation
- High compressibility and compliancy
- Increase the performance of electronics
Applications:
- Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.