TG6050 Ultra Soft Thermal Conductive Pad
Für das Produkt TG6050 Ultra Soft Thermal Conductive Pad besuchen Sie bitte unsere neue Webseite unter https://www.infratron.eu/gap-filler
- Very good thermal conductivity
- Compliancy - High Compressibility
- Natural Tack
- Low Hardness (Shore 00)
- Low Oil Blead-Long term Stability
- Electrical Insulating
Applications:
- Electronic components: IC / CPU / MOS
- LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc....
- DDR II Module / DVD Applications / Hand-Set applications etc...