Wärmeleitpaste und Wärmeleitpads

Keramik gefüllten einzelne Komponente Silikone mit einer hohen Wärmeleitfähigkeit

Thermisch leitfähige Pads (TIMs) Für die auffüllung der Luftspalte und der mikroskopischen Unregelmäßigkeiten, was zu einer deutlich niedrigerer thermischer Widerstand verwendeten und somit bessere Kühlung

• Non siloxane and oil-bleed
• Ultra soft and great elongation
• Electrical insulation
• Very low thermal impedance

• Good thermal conductivity
• Protect electronic components after cured
• A:B=1:1
• Cured by room temperature or heating

• Silicone-type spacer with great long term reliability
• Lower thermal contact impedance than thermal pads
• Physical property in between liquid and solid state
• Gap fillers for uneven or irregular surfaces of heat sources and heat sink
• Applicable for dispenser

• High thermal conductivity
• Good leveling property & no overflow
• Effectively fills surface irregularities
• Low thermal impedance
• Silicone base, environmental friendly

• Silicone free thermal gel
• Lower contact thermal impedance than thermal pads
• Physical property in between liquid and solid state
• Gap fillers for uneven or irregular surfaces of heat sources and heat sink
• Applicable for dispenser

• High thermal conductivity
• Silicone oil free
• No overflow
• Low thermal impedance / thermal resistance
• Non silicone based and environmental frien

• Good adhesion (Acrylic PSA)
• Great reliability
• Cost effective with great performance
• Easy to assemble
• Customization services